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XC7Z015-3CLG485E

485 Terminations0°C~100°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z015-3CLG485E
  • Package: 484-LFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 444
  • Description: 485 Terminations0°C~100°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 485
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Subcategory Other Microprocessor ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 866MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Artix™-7 FPGA, 74K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable N
Height Seated (Max) 1.6mm
Length 19mm
RoHS Status ROHS3 Compliant
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 484-LFBGA, CSPBGA
Number of Pins 485
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC is built.Its package is 484-LFBGA, CSPBGA.With 256KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.The Zynq?-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.In addition, this SoC security combines Artix?-7 FPGA, 74K Logic Cells.An advanced Tray package houses this SoC system on a chip.This SoC part has a total of 130 I/Os.Use a power supply with a voltage of 1V if possible.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.This SoC system on a chip can run on a power supply that is at least 0.95V.There are 485 terminations in total and that really benefits system on a chip.In the same way that other high-quality Other Microprocessor ICs will do, it is also capable of providing outstanding performance.You will need to provide 11.8V power supplies in order to run system on chip.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.At 866MHz, the wireless SoC works.In this SoC meaning, ARM serves as the core architecture.This SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The computer SoC is the 485-pin version.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z015-3CLG485E System On Chip (SoC) applications.

  • DC-input BLDC motor drive
  • Body control module
  • sequence controllers
  • Digital Signal Processing
  • External USB hard disk/SSD
  • Video Imaging
  • Industrial transport
  • ARM support modules
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