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XC7Z030-1SBG485C

485 Terminations0°C~85°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z030-1SBG485C
  • Package: 484-FBGA, FCBGA
  • Datasheet: PDF
  • Stock: 183
  • Description: 485 Terminations0°C~85°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 484-FBGA, FCBGA
Surface Mount YES
Number of Pins 485
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 485
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Subcategory Other Microprocessor ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable N
Height Seated (Max) 2.44mm
Length 19mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Package 484-FBGA, FCBGA is assigned to this system on a chip by the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq?-7000 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.A key point to note is that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.A 1V power supply should be used.In the SoCs wireless, high voltages above 1.05V are considered dangerous and should not be used.Power supply should be at least 0.95V.In total, there are 485 terminations, so system on a chip is really aided by this.Just like other high-quality Other Microprocessor ICs will do, it is of outstanding system on a chip capability.System on chip requires 11.8V power supplies.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.wireless SoCs operate at 667MHz.It uses ARM as its core architecture.The computer SoC has a pin count of 485.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM

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