All Products

XC7Z030-2FF676I

676 Terminations-40°C~100°C TJ XC7Z030 System On ChipZynq?-7000 Series 130 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z030-2FF676I
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 293
  • Description: 676 Terminations-40°C~100°C TJ XC7Z030 System On ChipZynq?-7000 Series 130 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Frequency 800MHz
Base Part Number XC7Z030
JESD-30 Code S-PBGA-B676
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN, ETHERNET, I2C, PCI, SPI, UART, USB
RoHS Status Non-RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Package 676-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Zynq?-7000 is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.In total, this SoC part has 130 I/Os.It is really beneficial to have system on a chip since there are 676 terminations in total.Searching XC7Z030 will yield system on chips with similar specs and purposes.In this wireless SoC, the frequency is set to 800MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z030-2FF676I System On Chip (SoC) applications.

  • Microcontroller based SoC ( RISC-V, ARM)
  • Special Issue Information
  • Industrial sectors
  • Keywords
  • Deep learning hardware
  • Healthcare
  • Industrial
  • System-on-chip (SoC)
  • Cyberphysical system-on-chip
  • Level