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XC7Z030-3SBG485E

485 Terminations0°C~100°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z030-3SBG485E
  • Package: 484-FBGA, FCBGA
  • Datasheet: PDF
  • Stock: 263
  • Description: 485 Terminations0°C~100°C TJ 485 Pin System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 484-FBGA, FCBGA
Number of Pins 485
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 485
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Subcategory Other Microprocessor ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 1GHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
UV Erasable N
Height Seated (Max) 2.44mm
Length 19mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.Its package is 484-FBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.The system on a chip is part of the series Zynq?-7000.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 125K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.It is recommended to use a 1V power supply.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.Power supply should be at least 0.95V.Having 485 terminations in total makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Other Microprocessor ICs.You will need to provide 11.8V power supplies in order to run system on chip.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.1GHz is the wireless SoC's frequency.In order to operate the SoC meaning, it must be based on the core architecture of ARM.Moreover, this SoC processor comes with PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.The computer SoC has 485 pins.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z030-3SBG485E System On Chip (SoC) applications.

  • POS Terminals
  • Functional safety for critical applications in the aerospace
  • External USB hard disk/SSD
  • Print Special Issue Flyer
  • Robotics
  • AC drive control module
  • Video Imaging
  • Automotive gateway
  • Medical
  • Central alarm system