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XC7Z030-L2FBG484I

484 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z030-L2FBG484I
  • Package: 484-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 230
  • Description: 484 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Package / Case 484-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B484
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 2.54mm
Length 23mm
Width 23mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.This system on a chip is packaged as 484-BBGA, FCBGA by the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.A system on chip SoC of this type belongs to the Zynq?-7000 series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 130 I/Os.A 1V power supply is recommended.In the SoCs wireless, voltages above 1.05V are considered unsafe.In order to run it, it must be fed by at least 0.95V of power.It is really beneficial to have system on a chip since there are 484 terminations in total.A frequency of 800MHz is used by the wireless SoC to operate.Based on the core architecture of ARM, the SoC meaning has a high level of performance.Moreover, this SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY as its additional features.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z030-L2FBG484I System On Chip (SoC) applications.

  • Industrial automation devices
  • Industrial AC-DC
  • DC-input BLDC motor drive
  • Measurement testers
  • Industrial sectors
  • Automotive gateway
  • Wireless sensor networks
  • Smart appliances
  • Functional safety for critical applications in the automotive
  • Industrial automation devices