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XC7Z030-L2SBG485I

485 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z030-L2SBG485I
  • Package: 484-FBGA, FCBGA
  • Datasheet: PDF
  • Stock: 816
  • Description: 485 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 484-FBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 485
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 0.8mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B485
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 100 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Number of Registers 157200
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 2.44mm
Length 19mm
Width 19mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Manufacturer assigns package 484-FBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides users with reliable performance.Internally, this SoC design uses the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.In addition, this SoC security combines Kintex?-7 FPGA, 125K Logic Cells.It comes in a state-of-the-art Tray package.In total, this SoC part has 130 I/Os.A power supply with a 1V rating is recommended.system on a chip benefits from 485 terminations.The wireless SoC works at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.Aside from that, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.It has a maximum supply voltage of 1.05V rated for it.Power is supplied to it at least in the amount of 950mV.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z030-L2SBG485I System On Chip (SoC) applications.

  • Automated sorting equipment
  • Industrial Pressure
  • Automotive gateway
  • Embedded systems
  • Mobile market
  • POS Terminals
  • Efficient hardware for inference of neural networks
  • Servo drive control module
  • Industrial robot
  • Efficient hardware for training of neural networks