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XC7Z035-2FFG676E

676 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z035-2FFG676E
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 632
  • Description: 676 Terminations0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V(Kg)

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Details

Tags

Parameters
Speed Grade 2
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
Number of Registers 343800
Height Seated (Max) 3.37mm
RoHS Status ROHS3 Compliant
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 676-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 110 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Its package is 676-BBGA, FCBGA.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.A system on chip SoC of this type belongs to the Zynq?-7000 series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.In addition, this SoC security combines Kintex?-7 FPGA, 275K Logic Cells.Tray package houses this SoC system on a chip.130 I/Os are included in this SoC part.A 1V power supply should be used.Having 676 terminations in total makes system on a chip possible.In this wireless SoC, the frequency is set to 800MHz.Core architecture of ARM underpins the SoC meaning.The SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY, which are additional features.It has a maximum supply voltage of 1.05V rated for it.Power is provided to it at least to the extent that 950mV is required.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z035-2FFG676E System On Chip (SoC) applications.

  • Communication interfaces ( I2C, SPI )
  • Industrial robot
  • Industrial automation devices
  • Mobile market
  • Efficient hardware for training of neural networks
  • Remote control
  • Industrial Pressure
  • Automotive
  • Deep learning hardware
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