All Products

XC7Z035-2FFV676E

0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z035-2FFV676E
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 806
  • Description: 0°C~100°C TJ System On ChipZynq?-7000 Series 130 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Operating Temperature 0°C~100°C TJ
Packaging Bulk
Published 2010
Series Zynq®-7000
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of I/O 130
Speed 800MHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Kintex™-7 FPGA, 275K Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).It has been assigned a package 676-BBGA, FCBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq?-7000 series.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 275K Logic Cells.Featured in the state-of-the-art Bulk package, this SoC system on a chip provides outstanding performance.This SoC part contains a total of 130 I/Os in total.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XC7Z035-2FFV676E System On Chip (SoC) applications.

  • ARM
  • High-end PLC
  • Networked sensors
  • Networked Media Encode/Decode
  • Keywords
  • Robotics
  • Vending machines
  • Fitness
  • Central alarm system
  • Sensor network-on-chip (sNoC)