XC7Z035-3FBG676E

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 275K Logic Cells.An advanced Tray package houses this SoC system on a chip.130 I/Os are available in this SoC part.For safe operation, it is advisable to utilize a power supply with 1V voltage.It is really beneficial to have system on a chip since there are 676 terminations in total.A frequency of 800MHz is used by the wireless SoC to operate.Based on the core architecture of ARM, the SoC meaning has a high level of performance.A maximum supply voltage of 1.05V is specified for the SoC security.At least 950mV power is delivered to it.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z035-3FBG676E System On Chip (SoC) applications.

• Special Issue Information
• Multiprocessor system-on-chips (MPSoCs)
• Cyber security for critical applications in the aerospace
• Industrial AC-DC
• Microprocessors
• Communication network-on-Chip (cNoC)
• Video Imaging
• Industrial robot
• Cyberphysical system-on-chip
• Medical