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XC7Z045-1FFG900C

900 Terminations0°C~85°C TJ 900 Pin XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V Min 1.2V VMax 3.3V V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z045-1FFG900C
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 468
  • Description: 900 Terminations0°C~85°C TJ 900 Pin XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V Min 1.2V VMax 3.3V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Number of Pins 900
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 3.3V
Min Supply Voltage 1.2V
Number of I/O 130
RAM Size 256KB
Memory Type ROMless
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Number of Logic Elements/Cells 190000
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.35mm
Length 31mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides users with reliable performance.Internally, this SoC design uses the MCU, FPGA technique.Zynq?-7000 is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.In the state-of-the-art Tray package, this SoC system on a chip is housed.An integral part of this SoC consists of a total of 130 I/Os.A power supply with a 1V rating is recommended.In total, there are 900 terminations, so system on a chip is really aided by this.Searching XC7Z045 will bring up system on chips with similar specs and purposes.During operation, the wireless SoC runs at a frequency of 667MHz.It uses ARM as its core architecture.The computer SoC is the 900-pin version.Supply voltage is rated at 3.3V.A minimum of 1.2V power is supplied to it.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z045-1FFG900C System On Chip (SoC) applications.

  • Functional safety for critical applications in the automotive
  • Embedded systems
  • Measurement tools
  • Wireless networking
  • Cyberphysical system-on-chip
  • Networked sensors
  • Keywords
  • Networked sensors
  • Wireless sensor networks
  • Flow Sensors