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XC7Z045-1FFG900I

900 Terminations-40°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z045-1FFG900I
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 499
  • Description: 900 Terminations-40°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
JESD-30 Code S-PBGA-B900
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Memory Type ROMless
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -1
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.35mm
Length 31mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Zynq?-7000 series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.Use a power supply with a voltage of 1V if possible.It is unsafe to operate the SoCs wireless at voltages above 1.05V.In total, there are 900 terminations, so system on a chip is really aided by this.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.The wireless SoC works at a frequency of 667MHz.Core architecture of ARM underpins the SoC meaning.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z045-1FFG900I System On Chip (SoC) applications.

  • Three phase UPS
  • Functional safety for critical applications in the automotive
  • Central alarm system
  • Measurement tools
  • Fitness
  • Remote control
  • Industrial Pressure
  • RISC-V
  • ARM processors
  • ARM support modules