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XC7Z045-2FBG676I

676 Terminations-40°C~100°C TJ 676 Pin XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z045-2FBG676I
  • Package: 676-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 513
  • Description: 676 Terminations-40°C~100°C TJ 676 Pin XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Surface Mount YES
Number of Pins 676
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Memory Type ROMless
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -2
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 2.54mm
Length 27mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.In the Zynq?-7000 series, this system on chip SoC is included.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells is important.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 130 I/Os.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.It is really beneficial to have system on a chip since there are 676 terminations in total.Search XC7Z045 for system on chips with similar specs and purposes.A frequency of 800MHz is used by the wireless SoC to operate.This SoC meaning utilizes a core architecture of ARM as its foundation.Currently, the computer SoC is available in a 676-pin version.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

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