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XC7Z045-3FFG900E

900 Terminations0°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z045-3FFG900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 468
  • Description: 900 Terminations0°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2009
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 1GHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z045
JESD-30 Code S-PBGA-B900
Operating Supply Voltage 1V
Supply Voltage-Max (Vsup) 1.05V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 130
RAM Size 256KB
Memory Type ROMless
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32b
Core Architecture ARM
Boundary Scan YES
Speed Grade -3
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.35mm
Length 31mm
Radiation Hardening No
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


On this SoC, there is Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Zynq?-7000 is the series name of this system on chip SoC.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.As one of the most important things to note is that this SoC security combines Kintex?-7 FPGA, 350K Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.130 I/Os are available in this SoC part.A power supply with a 1V rating is recommended.There are voltages higher than 1.05V that should be avoided when using the SoCs wireless.As a result, there are 900 terminations in total, which does really benefit system on a chip.Search XC7Z045 for system on chips with similar specs and purposes.At 1GHz, the wireless SoC works.It uses ARM as its core architecture.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z045-3FFG900E System On Chip (SoC) applications.

  • Keyboard
  • Efficient hardware for training of neural networks
  • Central alarm system
  • Communication network-on-Chip (cNoC)
  • External USB hard disk/SSD
  • Robotics
  • Functional safety for critical applications in the aerospace
  • Industrial
  • Industrial sectors
  • Industrial automation devices