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XC7Z100-1FFG900I

900 Terminations-40°C~100°C TJ XC7Z100 System On ChipZynq?-7000 Series 212 I/O1V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z100-1FFG900I
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 367
  • Description: 900 Terminations-40°C~100°C TJ XC7Z100 System On ChipZynq?-7000 Series 212 I/O1V (Kg)

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Parameters
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.35mm
Length 31mm
Width 31mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Factory Lead Time 10 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tube
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 667MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XC7Z100
JESD-30 Code S-PBGA-B900
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.95V
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Number of I/O 212
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq?-7000 series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines Kintex?-7 FPGA, 444K Logic Cells.There is a state-of-the-art Tube package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 212 I/Os.A power supply with a 1V rating is recommended.In the SoCs wireless, voltages above 1.05V are considered unsafe.Power supply should be at least 0.95V.A system on a chip benefits from having 900 terminations.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z100.At 667MHz, the wireless SoC works.Core architecture of ARM underpins the SoC meaning.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.


XC7Z100-1FFG900I System On Chip (SoC) applications.

  • Cyberphysical system-on-chip
  • Mouse
  • Industrial AC-DC
  • Smartphones
  • Industrial transport
  • Functional safety for critical applications in the automotive
  • Keywords
  • Healthcare
  • Microcontroller
  • Deep learning hardware