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XC7Z100-2FF900I

-40°C~100°C TJ System On ChipZynq?-7000 Series 212 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XC7Z100-2FF900I
Package: 900-BBGA, FCBGA
Datasheet: PDF
Stock: 592
Description: -40°C~100°C TJ System On ChipZynq?-7000 Series 212 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	10 Weeks
Package / Case	900-BBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq®-7000
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
Number of I/O	212
Speed	800MHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals	DMA
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Kintex™-7 FPGA, 444K Logic Cells
RoHS Status	Non-RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).

A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq?-7000 series.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 444K Logic Cells.An advanced Tray package houses this SoC system on a chip.This SoC part contains a total of 212 I/Os in total.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.

XC7Z100-2FF900I System On Chip (SoC) applications.

Sensor network-on-chip (sNoC)
PC peripherals
Healthcare
High-end PLC
Networked sensors
sequence controllers
AC drive control module
Smart appliances
Defense
Mobile market