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XC7Z100-L2FFG1156I

-40°C~100°C TJ 1156 Pin System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XC7Z100-L2FFG1156I
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 778
  • Description: -40°C~100°C TJ 1156 Pin System On ChipZynq?-7000 Series 130 I/O1V Min 950mV VMax 1.05V V(Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Package / Case 1156-BBGA, FCBGA
Number of Pins 1156
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Zynq®-7000
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
HTS Code 8542.39.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Terminal Pitch 1mm
Frequency 800MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Interface CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
Max Supply Voltage 1.05V
Min Supply Voltage 950mV
Number of I/O 130
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Propagation Delay 120 ps
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Turn On Delay Time 120 ps
Architecture MCU, FPGA
Core Architecture ARM
Boundary Scan YES
RAM (words) 256000
Primary Attributes Kintex™-7 FPGA, 444K Logic Cells
Number of Registers 554800
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Height Seated (Max) 3.1mm
Length 35mm
Width 35mm
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).Manufacturer assigns package 1156-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.Internally, this SoC design uses the MCU, FPGA technique.It is part of the Zynq?-7000 series of system on a chips.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.This SoC security combines Kintex?-7 FPGA, 444K Logic Cells and that is something to note.An advanced Tray package houses this SoC system on a chip.This SoC part has a total of 130 I/Os.Ideally, a power supply with a voltage of 1V should be used.A frequency of 800MHz is used by the wireless SoC to operate.In terms of core architecture, the SoC meaning relies on ARM.Additionally, this SoC processor features PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY.In this computer SoC, there are 1156 pins.The maximum supply voltage is rated as 1.05V.It is powered by at least 950mV.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

There are a lot of Xilinx Inc.


XC7Z100-L2FFG1156I System On Chip (SoC) applications.

  • Flow Sensors
  • Cyberphysical system-on-chip
  • Vending machines
  • ARM support modules
  • POS Terminals
  • Mobile market
  • POS Terminals
  • Functional safety for critical applications in the aerospace
  • Efficient hardware for training of neural networks
  • Deep learning hardware