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XCKU060-3FFVA1156E

FPGAs Kintex? UltraScale? Series 1156-BBGA, FCBGA


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCKU060-3FFVA1156E
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 316
  • Description: FPGAs Kintex? UltraScale? Series 1156-BBGA, FCBGA (Kg)

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Details

Tags

Parameters
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 1156-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Bulk
Published 2012
Series Kintex® UltraScale™
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Packing Method TRAY
Technology CMOS
Voltage - Supply 0.970V~1.030V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B1156
Number of Outputs 520
Qualification Status Not Qualified
Power Supplies 1V
Number of I/O 520
RAM Size 4.8MB
Memory Type RAM
Number of Inputs 520
Organization 2760 CLBS
Number of Logic Elements/Cells 725550
Total RAM Bits 38912000
Number of LABs/CLBs 41460
Speed Grade 3
Number of CLBs 2760
Max Junction Temperature (Tj) 100°C
Height 3.51mm
RoHS Status ROHS3 Compliant

XCKU060-3FFVA1156E Overview


As part of the 1156-BBGA, FCBGA package, it is included. The device has 520 I/O ports for more coherent data transfer. A fundamental building block is made up of 725550 logic elements/cells. Power is provided by a 1V-volt supply. FPGA modules can be attached to development boards using a Surface Mount-connector. In order to operate it, it requires a voltage supply of 0.970V~1.030V . It is a type of FPGA that belongs to the Kintex? UltraScale? series of FPGAs. Operating temperatures should be maintained within the 0°C~100°C TJ range at all times when the unit is in use. In this device, there are 520 outputs that can be used. It is for space saving reasons that this FPGA model is contained in Bulk. Having a RAM bit size of 38912000 means that this device will offer you a lot of memory. It is crucial that the RAM si4.8MBe of this FPGA module reaches 4.8MB so that the program can run normally. The FPGA is built as an array of 41460 latches or CLBs. Fpga electronics operates from a 1V power supply. In its architecture, there are 2760 CLB modules. Data is stored in the RAM memory, so resource conflicts are avoided. Due to most industry design purposes, fpga circuit adapts the packing method TRAY.

XCKU060-3FFVA1156E Features


520 I/Os
Up to 38912000 RAM bits

XCKU060-3FFVA1156E Applications


There are a lot of Xilinx Inc. XCKU060-3FFVA1156E FPGAs applications.

  • Defense Applications
  • Distributed Monetary Systems
  • Computer hardware emulation
  • Image processing
  • Data center hardware accelerators
  • OpenCL
  • Software-defined radio
  • Medical imaging
  • High Performance Computing
  • Artificial intelligence (AI)