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XCZU11EG-3FFVC1156E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU11EG-3FFVC1156E
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 637
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1156-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 360
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 1156-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides reliable operation.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.Zynq? UltraScale+? MPSoC EG is the series number of this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 653K+ Logic Cells, an important feature to keep in mind.Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 360 inputs and outputs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU11EG-3FFVC1156E System On Chip (SoC) applications.

  • AC drive control module
  • Measurement testers
  • RISC-V
  • Level
  • Samsung galaxy gear
  • POS Terminals
  • Industrial Pressure
  • Optical drive
  • Automotive gateway
  • Communication network-on-Chip (cNoC)