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  • XCZU17EG-1FFVB1517I

XCZU17EG-1FFVB1517I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 644 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU17EG-1FFVB1517I
  • Package: 1517-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 356
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 644 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1517-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 644
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.There is a 1517-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 926K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.644 I/Os are included in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU17EG-1FFVB1517I System On Chip (SoC) applications.

  • Level
  • Medical
  • Networked sensors
  • Communication interfaces ( I2C, SPI )
  • Medical Pressure
  • Robotics
  • Body control module
  • Automotive
  • Remote control
  • Special Issue Editors