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  • XCZU17EG-2FFVC1760E

XCZU17EG-2FFVC1760E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU17EG-2FFVC1760E
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 732
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 512
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Manufacturer assigns package 1760-BBGA, FCBGA to this system on a chip.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.Tray package houses this SoC system on a chip.In total, this SoC part has 512 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU17EG-2FFVC1760E System On Chip (SoC) applications.

  • Central inverter
  • Special Issue Information
  • Keyboard
  • Wireless sensor networks
  • Temperature
  • CNC control
  • Automotive gateway
  • DC-input BLDC motor drive
  • ARM processors
  • Digital Signal Processing