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  • XCZU17EG-2FFVD1760E

XCZU17EG-2FFVD1760E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU17EG-2FFVD1760E
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 350
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 308
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides reliable operation.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.An advanced Tray package houses this SoC system on a chip.This SoC part contains a total of 308 I/Os in total.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU17EG-2FFVD1760E System On Chip (SoC) applications.

  • Communication interfaces ( I2C, SPI )
  • Smart appliances
  • Central inverter
  • USB hard disk enclosure
  • Embedded systems
  • Smartphone accessories
  • External USB hard disk/SSD
  • POS Terminals
  • Efficient hardware for training of neural networks
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