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  • XCZU17EG-2FFVD1760I

XCZU17EG-2FFVD1760I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU17EG-2FFVD1760I
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 823
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 308
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the Zynq? UltraScale+? MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells together.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.308 I/Os are available in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU17EG-2FFVD1760I System On Chip (SoC) applications.

  • Functional safety for critical applications in the industrial sectors
  • Transmitters
  • USB hard disk enclosure
  • Wireless sensor networks
  • ARM support modules
  • Robotics
  • ARM
  • Temperature Sensors
  • Automated sorting equipment
  • String inverter