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  • XCZU17EG-2FFVE1924I

XCZU17EG-2FFVE1924I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU17EG-2FFVE1924I
  • Package: 1924-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 866
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1924-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 668
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is embedded in this SoC.The manufacturer assigns this system on a chip with a 1924-BBGA, FCBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides users with reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Zynq? UltraScale+? MPSoC EG series of system on a chips.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 668 I/Os in total.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU17EG-2FFVE1924I System On Chip (SoC) applications.

  • Three phase UPS
  • Central alarm system
  • Mouse
  • Vending machines
  • Medical
  • ARM support modules
  • Cyber security for critical applications in the aerospace
  • Keywords
  • Medical
  • Transmitters