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  • XCZU17EG-3FFVD1760E

XCZU17EG-3FFVD1760E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU17EG-3FFVD1760E
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 874
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 308
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).According to the manufacturer, this system on a chip has a package of 1760-BBGA, FCBGA.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells, an important feature to keep in mind.It comes in a state-of-the-art Tray package.308 I/Os are included in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU17EG-3FFVD1760E System On Chip (SoC) applications.

  • Mouse
  • Self-aware system-on-chip (SoC)
  • Smart appliances
  • Functional safety for critical applications in the aerospace
  • Automotive gateway
  • Networked sensors
  • Robotics
  • Mobile market
  • Vending machines
  • Digital Signal Processing