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XCZU17EG-L1FFVC1760I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU17EG-L1FFVC1760I
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 630
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 512 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1760
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 512
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.The manufacturer assigns this system on a chip with a 1760-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC EG series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.As a whole, this SoC part includes 512 I/Os.A power supply with a 0.72V rating is recommended.The SoCs wireless is considered unreliable if the voltage exceeds 0.742V.This SoC system on a chip can run on a power supply that is at least 0.698V.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.Moreover, this SoC processor is also equipped with additional features of ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

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