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XCZU17EG-L2FFVE1924E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU17EG-L2FFVE1924E
  • Package: 1924-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 952
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1924-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1924
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 668
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.Its package is 1924-BBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 926K+ Logic Cells.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 668 I/Os.A power supply with a 0.72V voltage rating should be utilized when using this system on chip SoC.It is unsafe to operate the SoCs wireless at voltages above 0.742V.As a minimum, the power supply of the SoC system on a chip needs to be 0.698V.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.Additionally, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU17EG-L2FFVE1924E System On Chip (SoC) applications.

  • Self-aware system-on-chip (SoC)
  • RISC-V
  • Automotive gateway
  • Apple smart watch
  • AC drive control module
  • External USB hard disk/SSD
  • Vending machines
  • Smart appliances
  • Communication network-on-Chip (cNoC)
  • Smart appliances