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  • XCZU19EG-1FFVD1760I

XCZU19EG-1FFVD1760I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU19EG-1FFVD1760I
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 982
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 308 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1760-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 308
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.Its package is 1760-BBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EG series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells.Housed in the state-of-art Tray package.308 I/Os in total are included in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU19EG-1FFVD1760I System On Chip (SoC) applications.

  • Mobile market
  • Fitness
  • Digital Signal Processing
  • Deep learning hardware
  • Functional safety for critical applications in the aerospace
  • Functional safety for critical applications in the industrial sectors
  • Video Imaging
  • Cyberphysical system-on-chip
  • Remote control
  • ARM processors