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  • XCZU19EG-2FFVE1924E

XCZU19EG-2FFVE1924E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU19EG-2FFVE1924E
  • Package: 1924-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 867
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 668 I/O(Kg)

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Details

Tags

Parameters
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status ROHS3 Compliant
Factory Lead Time 11 Weeks
Package / Case 1924-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 668
Speed 533MHz, 600MHz, 1.3GHz

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is integrated into this SoC.The manufacturer assigns this system on a chip with a 1924-BBGA, FCBGA package as per the manufacturer's specifications.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.A system on chip SoC of this type belongs to the Zynq? UltraScale+? MPSoC EG series.In general, this SoC meaning should operate at a temperature of 0°C~100°C TJ on a regular basis.This SoC security combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.668 I/Os are included in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU19EG-2FFVE1924E System On Chip (SoC) applications.

  • Digital Media
  • Cyber security for critical applications in the aerospace
  • Mobile market
  • Measurement testers
  • Level
  • Video Imaging
  • Automotive
  • USB hard disk enclosure
  • Temperature Sensors
  • Industrial robot