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XCZU19EG-L1FFVB1517I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 644 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU19EG-L1FFVB1517I
  • Package: 1517-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 931
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 644 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1517-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1517
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 644
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.This system on a chip is packaged as 1517-BBGA, FCBGA by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is part of the Zynq? UltraScale+? MPSoC EG series of system on a chips.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.This SoC security combines Zynq?UltraScale+? FPGA, 1143K+ Logic Cells and that is something to note.Tray package houses this SoC system on a chip.This SoC part has a total of 644 I/Os.Ideally, a power supply with a voltage of 0.72V should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.As a minimum, the power supply of the SoC system on a chip needs to be 0.698V.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU19EG-L1FFVB1517I System On Chip (SoC) applications.

  • Vending machines
  • Communication network-on-Chip (cNoC)
  • Video Imaging
  • External USB hard disk/SSD
  • AC drive control module
  • Networked sensors
  • Flow Sensors
  • Medical
  • Cyberphysical system-on-chip
  • Optical drive