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XCZU2CG-L1SFVA625I

625 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU2CG-L1SFVA625I
  • Package: 625-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 915
  • Description: 625 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 180 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 625-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 625
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B625
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 180
Speed 500MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) is built into this SoC.Manufacturer assigns package 625-BFBGA, FCBGA to this system on a chip.A 256KB RAM SoC chip provides reliable performance to users.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC CG series.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells.An advanced Tray package houses this SoC system on a chip.180 I/Os in total are included in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.72V.In the SoCs wireless, voltages above 0.742V are considered unsafe.If it has at least a 0.698V volt power supply, it can work fine.A system on a chip benefits from having 625 terminations.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.Moreover, this SoC processor comes with ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU2CG-L1SFVA625I System On Chip (SoC) applications.

  • Functional safety for critical applications in the automotive
  • Industrial sectors
  • Vending machines
  • POS Terminals
  • High-end PLC
  • CNC control
  • Wireless networking
  • Sports
  • ARM support modules
  • System-on-chip (SoC)