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  • XCZU3CG-2SFVC784E

XCZU3CG-2SFVC784E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU3CG-2SFVC784E
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 333
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O(Kg)

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Details

Tags

Parameters
Packaging Bulk
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 252
Speed 533MHz, 1.3GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Operating Temperature 0°C~100°C TJ

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is used to build this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.The system on a chip is part of the series Zynq? UltraScale+? MPSoC CG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 154K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Bulk package.As a whole, this SoC part includes 252 I/Os.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU3CG-2SFVC784E System On Chip (SoC) applications.

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  • Special Issue Information
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