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XCZU3CG-2SFVC784I

784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU3CG-2SFVC784I
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 900
  • Description: 784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O0.85V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Bulk
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Number of I/O 252
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is integrated into this SoC.Manufacturer assigns package 784-BFBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.In the Zynq? UltraScale+? MPSoC CG series, this system on chip SoC is included.The average operating temps for this SoC meaning should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.Housed in the state-of-art Bulk package.Total I/Os on this SoC part are 252.As a rule of thumb, it is advised to use a power supply with a value of 0.85V.In total, there are 784 terminations, which is great for system on a chip.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XCZU3CG-2SFVC784I System On Chip (SoC) applications.

  • Fitness
  • Central alarm system
  • Samsung galaxy gear
  • Healthcare
  • Cyber security for critical applications in the aerospace
  • Medical
  • Keywords
  • Robotics
  • Industrial automation devices
  • CNC control