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XCZU3CG-L1SBVA484I

484 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 82 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU3CG-L1SBVA484I
  • Package: 484-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 734
  • Description: 484 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 82 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 484-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 484
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B484
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 82
Speed 500MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 484-BFBGA, FCBGA package as per the manufacturer's specifications.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.In the Zynq? UltraScale+? MPSoC CG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.A key point to note is that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part has a total of 82 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 0.72V.The SoCs wireless cannot operate at a voltage greater than 0.742V because it is considered unsafe for the application.In order to run it, it must be fed by at least 0.698V of power.Having 484 terminations in total makes system on a chip possible.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Moreover, this SoC processor is also equipped with additional features of ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU3CG-L1SBVA484I System On Chip (SoC) applications.

  • Microcontroller based SoC ( RISC-V, ARM)
  • Embedded systems
  • Cyberphysical system-on-chip
  • Optical drive
  • Remote control
  • Temperature
  • Industrial Pressure
  • Flow Sensors
  • Measurement testers
  • Keywords