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  • XCZU3EG-1SFVC784I

XCZU3EG-1SFVC784I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU3EG-1SFVC784I
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 898
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 252 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 252
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 784-BFBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq? UltraScale+? MPSoC EG is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 252 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU3EG-1SFVC784I System On Chip (SoC) applications.

  • Mobile market
  • Functional safety for critical applications in the aerospace
  • Multiprocessor system-on-chips (MPSoCs)
  • Samsung galaxy gear
  • Optical drive
  • Industrial automation devices
  • POS Terminals
  • Vending machines
  • Smart appliances
  • Mouse