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XCZU3EG-L1SBVA484I

484 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 82 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU3EG-L1SBVA484I
  • Package: 484-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 463
  • Description: 484 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 82 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 484-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 484
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B484
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 82
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC is built.Its package is 484-BFBGA, FCBGA.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MCU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC EG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 154K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.82 I/Os are available in this SoC part.A power supply with a 0.72V rating is recommended.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.698V.The system on a chip uses 484 terminations in total.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU3EG-L1SBVA484I System On Chip (SoC) applications.

  • AC drive control module
  • Level
  • Wireless networking
  • Mobile market
  • Central alarm system
  • External USB hard disk/SSD
  • Microprocessors
  • Measurement testers
  • Body control module
  • Embedded systems