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  • XCZU4EG-3FBVB900E

XCZU4EG-3FBVB900E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU4EG-3FBVB900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 889
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O(Kg)

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Details

Tags

Parameters
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 600MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status ROHS3 Compliant
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC is built.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design is based on the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq? UltraScale+? MPSoC EG series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells is important.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part contains a total of 204 I/Os in total.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU4EG-3FBVB900E System On Chip (SoC) applications.

  • Personal Computers
  • Automotive
  • External USB hard disk/SSD
  • Measurement testers
  • Wireless networking
  • Deep learning hardware
  • ARM support modules
  • Medical
  • Functional safety for critical applications in the industrial sectors
  • POS Terminals