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XCZU4EV-L2FBVB900E

900 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU4EV-L2FBVB900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 785
  • Description: 900 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EV
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 204
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.With 256KB RAM implemented, this SoC chip provides users with reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq? UltraScale+? MPSoC EV series contains this system on chip SoC.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.A key point to note is that this SoC security combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells.Tray package houses this SoC system on a chip.204 I/Os are included in this SoC part.Ideally, a power supply with a voltage of 0.72V should be used.An excessive voltage of 0.742V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.There is a possibility that it can be powered by a power supply of at least 0.698V.In total, there are 900 terminations, which is great for system on a chip.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.Aside from that, this SoC processor features ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU4EV-L2FBVB900E System On Chip (SoC) applications.

  • Sensor network-on-chip (sNoC)
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  • Industrial Pressure
  • Personal Computers