All Products

View All >>

XCZU5CG-1SFVC784I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU5CG-1SFVC784I
Package: 784-BFBGA, FCBGA
Datasheet: PDF
Stock: 944
Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Package / Case	784-BFBGA, FCBGA
Operating Temperature	-40°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC CG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	252
Speed	500MHz, 1.2GHz
RAM Size	256KB
Core Processor	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
RoHS Status	ROHS3 Compliant
Factory Lead Time	11 Weeks

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).

There are Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.It is part of the Zynq? UltraScale+? MPSoC CG series of system on a chips.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 256K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part includes 252 I/Os.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.

XCZU5CG-1SFVC784I System On Chip (SoC) applications.

Networked sensors
Microcontroller based SoC ( RISC-V, ARM)
Functional safety for critical applications in the aerospace
Special Issue Information
Networked Media Encode/Decode
Transmitters
Microprocessors
Industrial AC-DC
Digital Signal Processing
Body control module