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XCZU5CG-2FBVB900I

900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU5CG-2FBVB900I
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 902
  • Description: 900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.85V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.876V
Supply Voltage-Min (Vsup) 0.825V
Number of I/O 204
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC is built.There is a 900-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC CG series.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 204 I/Os.A 0.85V power supply is recommended.An excessive voltage of 0.876V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.In order to run it, it must be fed by at least 0.825V of power.In total, there are 900 terminations, which is great for system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XCZU5CG-2FBVB900I System On Chip (SoC) applications.

  • Mobile market
  • CNC control
  • Temperature
  • Automated sorting equipment
  • Special Issue Editors
  • Sports
  • Digital Signal Processing
  • Industrial AC-DC
  • Digital Media
  • ARM processors