English

All Products

View All >>
  • XCZU5EV-1FBVB900E

XCZU5EV-1FBVB900E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU5EV-1FBVB900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 280
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
RoHS Status ROHS3 Compliant
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EV
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2, this SoC has been developed.It has been assigned a package 900-BBGA, FCBGA by its manufacturer for this system on a chip.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC EV series.It is expected that this SoC meaning will operate at 0°C~100°C TJ on average.A key point to note is that this SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells.Tray package houses this SoC system on a chip.As a whole, this SoC part includes 204 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU5EV-1FBVB900E System On Chip (SoC) applications.

  • USB hard disk enclosure
  • Industrial
  • Wireless networking
  • ARM processors
  • Central inverter
  • Industrial automation devices
  • Servo drive control module
  • Level
  • Communication network-on-Chip (cNoC)
  • Avionics