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  • XCZU5EV-3FBVB900E

XCZU5EV-3FBVB900E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU5EV-3FBVB900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 247
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EV
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 600MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


Based on the core processor(s) Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, this SoC has been developed.According to the manufacturer, this system on a chip has a package of 900-BBGA, FCBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.Zynq? UltraScale+? MPSoC EV is the series in which this system on chip SoC falls under.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 256K+ Logic Cells, an important feature to keep in mind.Housed in the state-of-art Tray package.As a whole, this SoC part includes 204 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU5EV-3FBVB900E System On Chip (SoC) applications.

  • Video Imaging
  • Body control module
  • Self-aware system-on-chip (SoC)
  • Wireless networking
  • ARM
  • Keywords
  • Wireless sensor networks
  • External USB hard disk/SSD
  • Robotics
  • Robotics