All Products

XCZU6CG-2FFVB1156E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 328 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU6CG-2FFVB1156E
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 834
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 328 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1156-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Bulk
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 328
Speed 533MHz, 1.3GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


There are Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processors in this SoC.Assigned with the package 1156-BBGA, FCBGA, this system on a chip comes from the manufacturer.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design is based on the MCU, FPGA technique.Featured system on chip SoCs of the Zynq? UltraScale+? MPSoC CG series.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells.Featured in the state-of-the-art Bulk package, this SoC system on a chip provides outstanding performance.328 I/Os in total are included in this SoC part.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU6CG-2FFVB1156E System On Chip (SoC) applications.

  • External USB hard disk/SSD
  • Robotics
  • Healthcare
  • Smart appliances
  • Automated sorting equipment
  • Mobile market
  • Wireless sensor networks
  • Apple smart watch
  • ARM
  • Industrial robot