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XCZU6CG-L1FFVB1156I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 328 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU6CG-L1FFVB1156I
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 328
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 328 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1156-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1156
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 328
Speed 500MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A core processor(s) Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is integrated into this SoC.Package 1156-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC CG series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part includes 328 I/Os.For safe operation, it is advisable to utilize a power supply with 0.72V voltage.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.Power supply should be at least 0.698V.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.Moreover, this SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY as its additional features.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU6CG-L1FFVB1156I System On Chip (SoC) applications.

  • PC peripherals
  • Temperature
  • Central alarm system
  • Automotive
  • Smartphones
  • Self-aware system-on-chip (SoC)
  • Industrial automation devices
  • Industrial automation devices
  • Video Imaging
  • POS Terminals