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XCZU6EG-3FFVC900E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O

Manufacturer: Xilinx Inc.
Origchip NO: 903-XCZU6EG-3FFVC900E
Package: 900-BBGA, FCBGA
Datasheet: PDF
Stock: 337
Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time	11 Weeks
Package / Case	900-BBGA, FCBGA
Operating Temperature	0°C~100°C TJ
Packaging	Tray
Published	2016
Series	Zynq® UltraScale+™ MPSoC EG
Part Status	Active
Moisture Sensitivity Level (MSL)	4 (72 Hours)
HTS Code	8542.31.00.01
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Number of I/O	204
Speed	600MHz, 1.5GHz
RAM Size	256KB
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals	DMA, WDT
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture	MCU, FPGA
Primary Attributes	Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status	ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s) are used in the construction of this SoC.Assigned with the package 900-BBGA, FCBGA, this system on a chip comes from the manufacturer.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The system on a chip is part of the series Zynq? UltraScale+? MPSoC EG.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 204 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.

XCZU6EG-3FFVC900E System On Chip (SoC) applications.

String inverter
Automotive gateway
Self-aware system-on-chip (SoC)
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Networked sensors
Functional safety for critical applications in the automotive
sequence controllers
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Personal Computers
Level