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XCZU6EG-L1FFVB1156I

-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 328 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU6EG-L1FFVB1156I
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 520
  • Description: -40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 328 I/O0.72V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1156-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1156
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 328
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is embedded in this SoC.Package 1156-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC EG series.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 469K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 328 I/Os.A 0.72V power supply is recommended.In the SoCs wireless, voltages above 0.742V are considered unsafe.As a minimum, the power supply of the SoC system on a chip needs to be 0.698V.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.Further features of this SoC processor are ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU6EG-L1FFVB1156I System On Chip (SoC) applications.

  • Industrial automation devices
  • Microcontroller based SoC ( RISC-V, ARM)
  • High-end PLC
  • USB hard disk enclosure
  • Robotics
  • ARM Cortex M4 microcontroller
  • Digital Media
  • Digital Signal Processing
  • ARM support modules
  • External USB hard disk/SSD