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XCZU7CG-2FBVB900I

900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU7CG-2FBVB900I
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 687
  • Description: 900 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O0.85V (Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 900
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B900
Supply Voltage-Max (Vsup) 0.876V
Supply Voltage-Min (Vsup) 0.825V
Number of I/O 204
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package as per the manufacturer's specifications.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.In the Zynq? UltraScale+? MPSoC CG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells is important.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.204 I/Os are available in this SoC part.A power supply with a 0.85V rating is recommended.It is unsafe to operate the SoCs wireless at voltages above 0.876V.Power supplies of at least 0.825V are required.In total, there are 900 terminations, which is great for system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XCZU7CG-2FBVB900I System On Chip (SoC) applications.

  • Industrial automation devices
  • Functional safety for critical applications in the aerospace
  • Microcontroller based SoC ( RISC-V, ARM)
  • ARM processors
  • Healthcare
  • Print Special Issue Flyer
  • Deep learning hardware
  • Measurement testers
  • Digital Signal Processing
  • Networked sensors