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  • XCZU7EG-3FBVB900E

XCZU7EG-3FBVB900E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU7EG-3FBVB900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 841
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 204 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


On this SoC, there is Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC EG series.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells.Housed in the state-of-art Tray package.As a whole, this SoC part includes 204 I/Os.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU7EG-3FBVB900E System On Chip (SoC) applications.

  • Smart appliances
  • Avionics
  • Measurement testers
  • Industrial automation devices
  • Remote control
  • Functional safety for critical applications in the industrial sectors
  • Self-aware system-on-chip (SoC)
  • Industrial automation devices
  • Three phase UPS
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