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  • XCZU7EG-3FFVC1156E

XCZU7EG-3FFVC1156E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU7EG-3FFVC1156E
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 826
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 1156-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 360
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).It has been assigned a package 1156-BBGA, FCBGA by its manufacturer for this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells.Housed in the state-of-art Tray package.360 I/Os in total are included in this SoC part.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU7EG-3FFVC1156E System On Chip (SoC) applications.

  • Embedded systems
  • Print Special Issue Flyer
  • Central alarm system
  • Measurement tools
  • Functional safety for critical applications in the automotive
  • System-on-chip (SoC)
  • Industrial AC-DC
  • Automotive gateway
  • Industrial transport
  • CNC control