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  • XCZU7EV-1FBVB900E

XCZU7EV-1FBVB900E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU7EV-1FBVB900E
  • Package: 900-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 427
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 204 I/O(Kg)

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Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EV
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 204
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 900-BBGA, FCBGA by the manufacturer.This SoC chip is equipped with 256KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.It is part of the Zynq? UltraScale+? MPSoC EV series of system on a chips.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq?UltraScale+? FPGA, 504K+ Logic Cells.This SoC system on a chip has been designed in a state-of-the-art Tray package.Total I/Os on this SoC part are 204.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU7EV-1FBVB900E System On Chip (SoC) applications.

  • Digital Media
  • String inverter
  • Self-aware system-on-chip (SoC)
  • Healthcare
  • Keyboard
  • POS Terminals
  • Wireless sensor networks
  • Apple smart watch
  • Industrial automation devices
  • Optical drive