All Products

XCZU7EV-2FFVC1156E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 360 I/O


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU7EV-2FFVC1156E
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 302
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EV Series 360 I/O(Kg)

Purchase & Inquiry

Transport

Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.
transport

Details

Tags

Parameters
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 360
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status ROHS3 Compliant
Factory Lead Time 11 Weeks
Package / Case 1156-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EV
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.Manufacturer assigns package 1156-BBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.A system on chip SoC of this type belongs to the Zynq? UltraScale+? MPSoC EV series.Temperatures should be 0°C~100°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of Zynq?UltraScale+? FPGA, 504K+ Logic Cells.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 360 inputs and outputs.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.


XCZU7EV-2FFVC1156E System On Chip (SoC) applications.

  • Remote control
  • ARM Cortex M4 microcontroller
  • Servo drive control module
  • Fitness
  • Self-aware system-on-chip (SoC)
  • Smart appliances
  • POS Terminals
  • Level
  • Video Imaging
  • Temperature Sensors